LO CICERO, UGOUGOLO CICEROArnone, ClaudioClaudioArnoneBARBERA, MarcoMarcoBARBERACOLLURA, AlfonsoAlfonsoCOLLURALullo, GiuseppeGiuseppeLullo2024-02-202024-02-2020120022-2291http://hdl.handle.net/20.500.12386/34785We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads. © Springer Science+Business Media, LLC 2012.STAMPAenElectroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter ArraysArticle10.1007/s10909-012-0560-42-s2.0-84863727584https://link.springer.com/article/10.1007/s10909-012-0560-4https://api.elsevier.com/content/abstract/scopus_id/848637275842012JLTP..167..535LFIS/05 - ASTRONOMIA E ASTROFISICAERC sectors::Physical Sciences and Engineering::PE9 Universe sciences: astro-physics/chemistry/biology; solar systems; stellar, galactic and extragalactic astronomy, planetary systems, cosmology, space science, instrumentation::PE9_17 Instrumentation – telescopes, detectors and techniques