MACCULI, CLAUDIOCLAUDIOMACCULIARGAN, ANDREAANDREAARGANTorrioli, G.G.Torrioli2024-05-302024-05-302021http://hdl.handle.net/20.500.12386/35164The main purpose of the present plan is to provide a clear path to demonstrate the CryoAC TRL5 by the mission Adoption. The reference statement from which we have derived our present CryoAC Technology Demonstration Plan comes from the “X-IFU Critical Items Demonstration Plan” document (see [RD1]). It reports: “The Technology should not be developed to the detriment of the Design. The confusion between Technology demonstration and Design has for consequence to go into Technology demonstration by sacrifying the design with negative impacts: - Poor requirements - Poor level of trade-offs - Poor understanding of design drivers” Hence, after having identified the main critical items an effort has been performed in trying to separate, as much as possible, the CryoAC technology from the CryoAC design. The identified items are: - Chip (it is the etched Si wafer having on-board the TES network, Nb wiring, and heaters) - CFEE (this is mainly constituted by the SQUID pcb) - Mechanics (this is the metallic supporting frame to host the chip) - Cold Assembly (this is the union of the above items) This document is structured as follows. We will show: - in § 2 a brief overview of the CryoAC detector - in § 3 a brief report about the CryoAC concept validation - in § 4, for each above identified item, the separation between technology and design - in § 5 the CryoAC model philosophy - in § 6 the list of the technological processes - in § 6 the critical technologies or processes that are the main driver to get TRL5 - in § 8 the planning Then the Conclusion.ELETTRONICOenResearch reportFIS/05 - ASTRONOMIA E ASTROFISICA