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Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays

Journal
Date Issued
2012
Author(s)
•
Arnone, Claudio
•
•
•
Lullo, Giuseppe
DOI
Abstract
We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads. © Springer Science+Business Media, LLC 2012.
Volume
167
Issue
3-4
Start page
535
Uri
Url
Issn Identifier
0022-2291
Ads BibCode
2012JLTP..167..535L
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restricted
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