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|Title:||IASF BO copper strap thermal conductance test report||Authors:||TERENZI, LUCA
|Issue Date:||2017||Number:||iALMA-TEC-TRP-IAB-009-A||Abstract:||The 20K stage of the Band2+3 cartridge prototype is designed in such a way that the whole unit has an optimized thermal homogeneity. For this reason the Low Noise Amplifier chain assembly is linked to the copper supporting structure through dedicated high conductivity copper thermal straps. The preliminary design considered a thermal braid with effective conductance of 0.44 W/K at 20 K. This document reports about the thermal conductance measurement of the thermal strap manufactured at the CryoWaves Lab to be integrated in the cartridge assembly during the preliminary verification tests.||URI:||http://hdl.handle.net/20.500.12386/33499||Fulltext:||open|
|Appears in Collections:||4.03 Rapporti di progetto|
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