IASF BO copper strap thermal conductance test report
Date Issued
2017
Author(s)
Abstract
The 20K stage of the Band2+3 cartridge prototype is designed in such a way that the whole unit has an optimized thermal homogeneity. For this reason the Low Noise Amplifier chain assembly is linked to the copper supporting structure through dedicated high conductivity copper thermal straps. The preliminary design considered a thermal braid with effective conductance of 0.44 W/K at 20 K. This document reports about the thermal conductance measurement of the thermal strap manufactured at the CryoWaves Lab to be integrated in the cartridge assembly during the preliminary verification tests.
Volume
iALMA-TEC-TRP-IAB-009-A
Rights
open.access
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Name
iALMA-TEC-TRP-IAB-009-A.pdf
Size
667.89 KB
Format
Adobe PDF
Checksum (MD5)
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