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http://hdl.handle.net/20.500.12386/34785
Title: | Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays | Authors: | LO CICERO, UGO Arnone, Claudio BARBERA, Marco COLLURA, Alfonso Lullo, Giuseppe |
Issue Date: | 2012 | Journal: | JOURNAL OF LOW TEMPERATURE PHYSICS | Number: | 167 | Issue: | 3-4 | First Page: | 535 | Abstract: | We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads. © Springer Science+Business Media, LLC 2012. | Note: | This version of the article has been accepted for publication, after peer review (when applicable) and is subject to Springer Nature’s AM terms of use, but is not the Version of Record and does not reflect post-acceptance improvements, or any corrections. The Version of Record is available online at: http://dx.doi.org/10.1007/s10909-012-0560-4 | URI: | http://hdl.handle.net/20.500.12386/34785 | URL: | https://link.springer.com/article/10.1007/s10909-012-0560-4 https://api.elsevier.com/content/abstract/scopus_id/84863727584 |
ISSN: | 0022-2291 | DOI: | 10.1007/s10909-012-0560-4 | Bibcode ADS: | 2012JLTP..167..535L | Fulltext: | mixedopen |
Appears in Collections: | 1.01 Articoli in rivista |
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LoCicero2012 - Electroplated indium bumps_main.pdf | [Administrators only] | 472 kB | Adobe PDF | |
LoCicero2012 - Electroplated indium bumps_postprint.pdf | postprint | 199.32 kB | Adobe PDF | View/Open |
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