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http://hdl.handle.net/20.500.12386/34975| Title: | Thermalization of a SQUID Chip at Cryogenic Temperature: Thermal Conductance Measurement for GE 7031 Varnish Glue, Apiezon N Grease and Rubber Cement Between 20 and 200 mK | Authors: | D'ANDREA, MATTEO Torrioli, G. MACCULI, CLAUDIO Kiviranta, M. |
Issue Date: | 2024 | Journal: | JOURNAL OF LOW TEMPERATURE PHYSICS | Number: | 214 | Issue: | 3-4 | First Page: | 190 | Abstract: | In the context of the ATHENA X-IFU Cryogenic AntiCoincidence detector (CryoAC) development, we have studied the thermalization properties of a 2 × 2 mm SQUID chip. The chip is glued on a front-end PCB and operated on the cold stage of a dilution refrigerator (TBASE < 20 mK). We performed thermal conductance measurements by using different materials to glue the SQUID chip on the PCB. These have been repeated in subsequent cryostat runs, to highlight degradation effects due to thermal cycles. Here, we present the results obtained by glues and greases widely used in cryogenic environments, i.e., GE 7031 Varnish Glue, Apiezon N Grease and Rubber Cement. | URI: | http://hdl.handle.net/20.500.12386/34975 | URL: | https://link.springer.com/article/10.1007/s10909-023-03038-1 https://api.elsevier.com/content/abstract/scopus_id/85183022847 |
ISSN: | 0022-2291 | DOI: | 10.1007/s10909-023-03038-1 | Fulltext: | open |
| Appears in Collections: | 1.01 Articoli in rivista |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 2024 - J Low Temp Phys - DAndrea et al SQUID therm.pdf | Pdf editoriale | 1.58 MB | Adobe PDF | View/Open |
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