Please use this identifier to cite or link to this item:
http://hdl.handle.net/20.500.12386/34975
DC Field | Value | Language |
---|---|---|
dc.contributor.author | D'ANDREA, MATTEO | en_US |
dc.contributor.author | Torrioli, G. | en_US |
dc.contributor.author | MACCULI, CLAUDIO | en_US |
dc.contributor.author | Kiviranta, M. | en_US |
dc.date.accessioned | 2024-03-18T14:12:25Z | - |
dc.date.available | 2024-03-18T14:12:25Z | - |
dc.date.issued | 2024 | en_US |
dc.identifier.issn | 0022-2291 | en_US |
dc.identifier.uri | http://hdl.handle.net/20.500.12386/34975 | - |
dc.description.abstract | In the context of the ATHENA X-IFU Cryogenic AntiCoincidence detector (CryoAC) development, we have studied the thermalization properties of a 2 × 2 mm SQUID chip. The chip is glued on a front-end PCB and operated on the cold stage of a dilution refrigerator (TBASE < 20 mK). We performed thermal conductance measurements by using different materials to glue the SQUID chip on the PCB. These have been repeated in subsequent cryostat runs, to highlight degradation effects due to thermal cycles. Here, we present the results obtained by glues and greases widely used in cryogenic environments, i.e., GE 7031 Varnish Glue, Apiezon N Grease and Rubber Cement. | en_US |
dc.language.iso | eng | en_US |
dc.title | Thermalization of a SQUID Chip at Cryogenic Temperature: Thermal Conductance Measurement for GE 7031 Varnish Glue, Apiezon N Grease and Rubber Cement Between 20 and 200 mK | en_US |
dc.type | Article | - |
dc.identifier.doi | 10.1007/s10909-023-03038-1 | en_US |
dc.identifier.scopus | 2-s2.0-85183022847 | en_US |
dc.identifier.url | https://link.springer.com/article/10.1007/s10909-023-03038-1 | en_US |
dc.identifier.url | https://api.elsevier.com/content/abstract/scopus_id/85183022847 | en_US |
dc.relation.medium | STAMPA | en_US |
dc.relation.volume | 214 | en_US |
dc.relation.issue | 3-4 | en_US |
dc.relation.firstpage | 190 | en_US |
dc.relation.lastpage | 199 | en_US |
dc.type.referee | REF_1 | en_US |
dc.description.international | sì | en_US |
dc.contributor.country | ITA | en_US |
dc.contributor.country | FIN | en_US |
dc.relation.scientificsector | FIS/05 - ASTRONOMIA E ASTROFISICA | en_US |
dc.relation.journal | JOURNAL OF LOW TEMPERATURE PHYSICS | en_US |
dc.type.miur | 262 Articolo in rivista | - |
dc.description.apc | sì | en_US |
dc.description.oa | 1 – prodotto con file in versione Open Access (allegare il file al passo 5-Carica) | en_US |
item.openairecristype | http://purl.org/coar/resource_type/c_18cf | - |
item.openairetype | Article | - |
item.languageiso639-1 | en | - |
item.cerifentitytype | Publications | - |
item.grantfulltext | open | - |
item.fulltext | With Fulltext | - |
crisitem.author.dept | IAPS Roma | - |
crisitem.author.dept | IAPS Roma | - |
crisitem.author.orcid | 0000-0002-5139-4578 | - |
crisitem.author.orcid | 0000-0002-7887-1485 | - |
crisitem.journal.journalissn | 0022-2291 | - |
crisitem.journal.ance | E092553 | - |
Appears in Collections: | 1.01 Articoli in rivista |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
2024 - J Low Temp Phys - DAndrea et al SQUID therm.pdf | Pdf editoriale | 1.58 MB | Adobe PDF | View/Open |
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